die bonding
US: /ˈdaɪ ˌbɑndɪŋ/
Definition

Definition of die bonding - Reverso English Dictionary

Noun

technologyTECH.process of fixing a semiconductor chip onto a base or packageTECH.
  • Die bonding is a critical step in semiconductor device assembly.
  • Die bonding ensures precise alignment between the chip and the lead frame.
  • Improper die bonding can lead to device failure under thermal stress.
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  1. French:processus de fixation d'une puce semi-conductrice sur un support ou dans un boîtier, ...
  2. German:Die-Bonding, ...
  3. Italian:fissaggio del chip, ...
  4. Spanish:unión del chip, ...
  5. Portuguese:ligação do die, ...
  6. Chinese:芯片粘接, ...
  7. Japanese:ダイボンディング, ...
  8. Arabic:رَبْط الشَّريحة, ...
  9. Hebrew:הַדְבָּקַת שְׁבָב, ...
  10. Russian:крепление кристалла, ...
  11. Ukrainian:кріплення кристала, ...
  12. Hindi:डाई बॉन्डिंग, ...

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